Building Chips in America Act of 2023

The Building Chips in America Act of 2023 (S. 2228) amends federal law to streamline environmental reviews for semiconductor manufacturing projects receiving federal financial assistance. It clarifies that certain projects won't be considered "major Federal actions" under the National Environmental Policy Act (NEPA) if they meet specific criteria: the project must have begun by December 31, 2024; federal assistance must be in loan/guarantee form; or non-loan assistance must be 10% or less of total project costs. The bill establishes categorical exclusions for environmental reviews related to semiconductor projects and designates the Department of Commerce as lead agency for these reviews. This primarily affects semiconductor manufacturers receiving federal funding under the CHIPS Act, reducing regulatory barriers for facility construction and expansion.