HR 6207 United States House · 119th Congress

Chip EQUIP Act

The Chip EQUIP Act restricts federal funding for semiconductor manufacturing equipment made by foreign entities designated as security concerns (or their subsidiaries). It prohibits the use of such "ineligible" equipment - defined as completed, fully assembled tools like etching, lithography, or inspection machines - in projects receiving federal financial assistance for 10 years. The bill requires federal agreements to include this ban, with limited waivers allowed only if the equipment is unavailable from U.S. or allied sources, was refurbished by a foreign entity of concern but originally made by a non-concern entity, or meets export rules and national security criteria. This directly affects companies receiving federal funds for semiconductor manufacturing facilities.
Bill status in committee 1 of 4 stages cleared
Introduction
Nov 2025
Committee Review
Floor Vote
President
Introduced Nov 20, 2025 Last action Sep 1, 2026
Floor votes

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Full legislative history

Actions timeline

Total actions
5
Key actions
2
Committee
4
Sep 1, 2026
Lower · Passed
Forwarded by Subcommittee to Full Committee (Amended) by Voice Vote.
lower
Sep 1, 2026
Lower · Passed
Subcommittee Consideration and Mark-up Session Held
lower
Nov 20, 2025
Committee
Referred to the Subcommittee on Commerce, Manufacturing, and Trade.
lower
Nov 20, 2025
Committee
Referred to the Committee on Energy and Commerce, and in addition to the Committee on Science, Space, and Technology, for a period to be subsequently determined by the Speaker, in each case for consideration of such provisions as fall within the jurisdiction of the committee concerned.
lower
Nov 20, 2025
Introduced
Introduced in House
lower
1 primary · 11 co-sponsors

Sponsors